The package design of MtM+ M905 is Land Grid Array(LGA) package. The LGA package is a standard flip-chip Ball Grid Array (BGA) shipped with no spheres.
The LGA solder interconnect is formed solely by solder paste applied at board assembly because there are no spheres attached to the LGA. This results in a lower standoff height of approximately 0.06 mm to 0.10 mm, depending on solder paste volume and printed circuit board (PCB) geometry.
The stencil’s thickness is 100 µm for solder paste of MtConnect05, and opening smaller 10µm than the foot print of M905.
Print the Solder Paste
Solder paste needs to be screened onto the LGA pads and the part taken through reflow furnace (Surface mount Process simulation test per JEDEC spec “Solderability” JESD22-B102D)
Before the reflow process, examine the X-ray of the M905’s placement. The 52 pads of M905 are square like the blue rectangles in the picture. After printing the solder paste, they must be in the center of M905’s pads without any overflow. Others objects beyond the blue rectangle like the rounds and big shadows, they are the components inside the M905’s SiP module.
Reflow soldering is the most common method of attaching surface mount components to a PCB. The process is to melt the solder and heat the adjoining surfaces, without overheating and damaging the electrical components. The reflow profile describes the ideal temperature curve of the top layer of the PCB.
After the reflow process, the x-ray inspection shows the quality of whole SMT process. The major criteria are:
- There is no short between any pads of M905.
- The void should less than 25%.
- There is no damage inside the module.
We have the assembly guideline with the recommendations of the SMT process. If you need further assistance, please feel free to contact us.